We had a chance to take a picture of one of the first publicly showcased 32nm wafers. It was made in Globalfoundries' Dresden Fab1 and it is a test 300mm wafer containing some core logic and memory chips. These are not real products, they are the result of a test production run and part of the learning curve how to get 32nm ready for clients in 2010.

According to Globalfoundries' plans, they will be ready to start 32nm high metal gate, silicon on isolator production in early Q3 2010, at least three quarters behind Intel, but AMD won’t be ready to start making its 32nm Bulldozer chips until some point in 2011.

We are still not aware of any plans for AMD to shrink 45nm Phenom quad, hexa and dual cores to 32nm as this would cost them a lot of engineering time that they now most likely cannot spare. Here is the wafer.



You can see a bigger picture here.