A few executives have confirmed that Globalfoudries FAB 2 has high hopes for the new 28nm manufacturing process.

They said that many of the customers they talked to would rather take 28nm half node than the 32nm full node, despite the fact that it might come a bit later.

First tape outs in 28nm should take place in Q4 2010, so roughly a bit more than a year from now, while the first so-called risked production should start in 1H of 2011.

Low Power devices such as wireless, handheld and other consumer chips might start manufacturing toward the end of Q2 2011 while general purpose chips including graphics, embedded, wired and DSPs might start coming out of Fab in late Q1 2011.

32nm risk production should start toward the end of Q2 2010.