Chimpakers are teaming up to develop the next-generation, 28nm chip manufacturing process, and the first 28nm products are expected in the second half of 2010.

The IBM-led alliance consists of IBM, Samsung Electronics, STMicroelectronics, Globalfoundries, Chartered Semiconductor and Infineon. The companies have joined forces to develop the 28nm high-k metal gate process, and IBM claims customers can start the design process in 32nm and then transition to 28nm at a later point.

Intel, on the other hand, is developing its own 32nm process, and CEO Paul Otellini expects the chipmaker will start shipments of 32nm silicon later this year.

More here.