Kaohsiung is now the proud home of TSMC’s first 12-inch fab in the region, gearing up for mass production in 2025. Even more impressive, the equipment installation started over six months ahead of schedule. Apple and AMD will be first in line for these cutting-edge chips.

TSMC’s 2nm strategy is charging ahead on two fronts. First, the flagship Baoshan fab in Hsinchu, and now the Kaohsiung facility, both set to start mass production in 2025. The Baoshan plant led the charge with its equipment installation in April 2024, but Kaohsiung’s rapid expansion is cementing its pivotal role in southern Taiwan’s semiconductor scene.

Originally slated for older tech, the Kaohsiung fab switched gears to 2nm production in August 2023. This move is backed by booming customer demand.

Chairman C.C. Wei recently revealed that inquiries for 2nm nodes are through the roof, outpacing those for 3nm, with capacity expected to soar.

Southern Taiwan’s current semiconductor heavyweight is Tainan’s Science Park, pumping out 3nm chips. But with Kaohsiung stepping up to the 2nm plate, it’s set to become a powerhouse in advanced chip manufacturing.

To keep up with the rising demand, Tainan’s facilities might also join the 2nm revolution, bolstering Taiwan’s dominance in next-gen semiconductor technology.