Recently, Taiwan Semiconductor Manufacturing Company held a ceremony at its headquarters in Northeastern Taiwan to mark the completion of the Phase 5 installment of its 12-inch ‘Gigafab’ facility, more commonly known as Fab 12. In other words, expect more research and development from the company in the areas of 28nm and 22nm advanced lithography later this year as management gets underway.

TSMC has stated that its Phase 4 and Phase 5 facilities at Fab 12 are specifically designated for R&D as well as initial volume production. The company is conducting research and development of 28nm and 22nm processes at its Phase 1 and Phase 2 facilities and will hand off volume production to Phase 5 in Q4 2010. Before then, however, risk production of 28nm will begin at the new Phase 5 facility in Q3 2010.

"The topping of our Fab 12, Phase 5 facility, and our plans to rapidly move in equipment and begin volume production there in the third quarter of 2010 is another example of our competitiveness in providing steadfast support for customers," said Mark Liu, TSMC's Senior VP of Operations.




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