Intel announced that they finished the development phase of the process that will shrink the existing circuitry to 32nm, which will, of course, result in more muscle and less consumption.

Chipzilla also announced that “the company is on track for production readiness” sometime in Q4 2009. All the needed technical details will be, they added, presented next week on International Electron Devices Meeting in San Francisco.

The 32nm process will use “second generation high-k + metal gate technology, 193nm immersion lithography for critical patterning layers and enhanced transistor strain techniques.”

On the same meeting, Intel will announced future enhancements to the 45nm process, which will improve on performance and general internal design.

More here.