Significantly faster thanks to Armv9 CPU cores and Mali-G615 GPU

MediaTek has announced its newest Dimensity 8000-series SoC, the Dimensity 8300. The new SoC is both faster and much more efficient thanks to the fact it is manufactured on TMSC's 4nm manufacturing process and comes with Armv9 CPU cores and the new Mali-G615 GPU.

4nm SoC with support for LPDDR5 3,200 memory and UFS 3.1 storage

Qualcomm has unveiled its latest Snapdragon 4 Gen 2 SoC for entry-level smartphones. This one is manufactured on a 4nm manufacturing process and brings the same core configuration as its predecessor but with some improvements, including LPDDR5 memory and UFS 3.1 storage support.

Believes it has a future

While many people don’t hold out much hope for Intel’s involvement in the GPU market, apparently Chipzilla has ordered a stack of chips from TSMC.

4nm 28W Phoenix beats 45W Ryzen 9 6900HX

AMD's 4nm Phoenix Ryzen 7040U low-power lineup has not been officially announced yet, but it already has been doing quite well in leaked benchmarks, with the Ryzen 7 7480U doing quite well against some previous heavy-hitters like the Ryzen 9 6900HX or Intel's Core i7-12800H.

Will be opened in 2024

TSMC has promised it will make 4nm chips at its semiconductor fab in Arizona, when it opens in 2024.

ARM Cortex-X3 prime core and Immortalis G715 GPU with hardware ray tracing

MediaTek has unveiled its latest flagship smartphone SoC, the Dimensity 9200. Built on TSMC 4nm (N4P) manufacturing process, this is also the first SoC to feature the ARM Cortex-X3 core based on ARMv9 architecture, as well as the new Immortalis-G715 GPU with hardware-based ray tracing.

Commercialise 8nm this year and 7nm next year

Samsung Electronics has been showing off its roadmap for introduction of high-tech 4-nano system semiconductor foundry process in 2020.