
Samsung Galaxy S23 series leaks in high-res pictures
Three phones officially launching early next month
The Samsung Galaxy S23 series is rumored to launch early next month, and while we have already seen several leaks, the most recent shows all three versions in high-res pictures.

Samsung slumps
Fourth quarter results poor due to Apple production delays
Samsung has reported an eight-year low for its operating profit in its fourth earnings results, dropping to $3.4 billion from $10.9 billion last year.

Samsung puts the slide into foldables
Apple is still not there yet
Last year, Samsung was showing off folding displays, but its Flex Hybrid OLED mobile screen can slide this year.

Huawei learns how extreme ultraviolet lithography works
China no longer depends on Dutch or US tech
Huawei is now able to create chips using extreme ultraviolet lithography (EUV) which means that it finally has a foot in the door of serious chip development.

Samsung shows new Galaxy Book2 Pro 360
With Qualcomm Snapdragon 8cx Gen 3
Samsung has officially announced its newest version of the Galaxy Book2 Pro 360, one powered by Qualcomm's Snapdragon Gen 3 SoC.

Samsung shows off 12nm DDR5 DRAM
Works with AMD's Zen
Samsung has unveiled the world’s first 12nm DDR5 DRAM chips.

Samsung pimps GPUs with PIMS
Built in AI
Samsung has built the world's first large scale computing system using GPUs with built in processing-in-memory (PIM) chips.

Samsung's in-house chipmaking gaining momentum
New division formed to make its own chips
While Samsung's flagships has been largely dependent on Qualcomm chips, and its new Galaxy S23 series is expected to arrive with the Snapdragon 8 Gen 2 processor on board, it appears that the company wants to create its own smartphone silicon.

Samsung partners with NAVER on AI chips
NAVER say never
Samsung has partnered with NAVER to develop semiconductors that can better handle AI workloads.

Samsung creates a new GDDR6 memory
FOWL play expected
Samsung has introduced a new GDDR6 memory that doubles the DRAM package's capacity and increases interface width to double its peak bandwidth.