TSMC pulls off EUV on 1000 wafers
Exposes itself
Chipmaking gear maker ASML has told the world that that its customer TSMC has exposed more than 1000 wafers on an NXE:3300B EUV system in a single day.
AMD Fiji HBM limited to 4GB stacked memory
Cannot fit more on 2.5D interposer
In early January we heard a thing or two about an AMD card codenamed Fiji, the one that comes with High Bandwidth Memory (HBM).
Qualcomm reportedly tweaks Snapdragon 810
Overheating issue resolved, or so they say
Qualcomm and TSMC have reportedly worked out overheating issues on the Snapdragon 810.
Shield Tablet with Tegra X1 coming soon
By the end of March
It doesn’t come as a surprise that Nvidia is working on a new iteration of the Shield tablet.
TMSC eying Apple for 16nm chips
Apple A9 or A10 we wonder
It looks like 2015 iPhones will be getting 14nm SoC chips manufactured by Samsung and GlobalFoundries.
TSMC 16nm FinFET Plus in risk production
First designs tape out in late 2015
TSMC: Volume production of 16nm FinFET in 2H 2015
Late Q2 or early Q3
TSMC does better than expected
Mobile still going strong
ARM and TSMC plan 10nm FinFET
64-bit ARM of course
Samsung is working on 14nm chips for Apple
Qualcomm and AMD included