Sung Joo Hong, the head of DRAM development at SK Hynix said that the development of the world’s first 128GB DDR4 module has its significance in opening ultrahigh density server market. SK Hynix will further strengthen its competitiveness in premium DRAM sphere with the development of high density, ultrahigh speed and low power consuming products, he insisted. SK Hynix is using Through Silicon Via technology which passes electrical connections vertically through a silicon die.
This means that it has double the density of previous memory modules. This new DDR4-based memory module runs at 2133Mbps and will be able to process data at 17GB per-second over its 64-bit wide bus. It will have power requirement of 1.2V, where DDR3 requires 1.5V.
We are expecting to see mass production of the 128GB DDR4 RAM module in the first half of 2015. This will be a little head of itself as there will not be many motherboards on the market will support over 32GB of RAM.