3nm processing wars

Samsung’s bottom line might get a boost from the fruity cargo-cult Apple’s decision to stick all its 3nm processing in TMSC’s basket.

A rival for Qualcomm’s Snapdragon 7 Gen 1

MediaTek has unveiled the Dimensity 7200, a new mid-range phone chipset which is believed to be targeted against Qualcomm’s Snapdragon 7 Gen 1.

Qualcomm rumoured to be having a rethink

The dark satanic rumour mill has manufactured a hell on earth yarn that Qualcomm is rethinking releasing its Snapdragon 8 Gen 3 using the 3nm process.

Future opportunity

MediaTek has been explaining how it plans to address Qualcomm's Arm-based Windows PC market using a variant of its Kompanio mobile processor.

ARM Cortex-X3 prime core and Immortalis G715 GPU with hardware ray tracing

MediaTek has unveiled its latest flagship smartphone SoC, the Dimensity 9200. Built on TSMC 4nm (N4P) manufacturing process, this is also the first SoC to feature the ARM Cortex-X3 core based on ARMv9 architecture, as well as the new Immortalis-G715 GPU with hardware-based ray tracing.

Higher clocks and 200MP ISP

MediaTek has announced its new Dimenstiy 1080 chipset, a mid-tier SoC that brings clock and camera improvements compared to the Dimensity 920 SoC.

Xiaomi 12T sticks with 108MP camera and Dimensity 8100 Ultra SoC

Xiaomi held a rather big European event in Munich, Germany, unveiling its new Xiaomi 12T series smartphones, the Xiaomi 12T Pro and the Xiaomi 12T.

Tame Apple Press claims fruity cargo cult will be the first to get it 

TSMC is on track to launch the much-awaited 3nm process node in September and mainstream media loyal to the fruity Apple cult insist that it will be its first 3nm customer.

Form foundry partnership

Intel and MediaTek today announced a strategic partnership to manufacture chips using Intel Foundry Services’ (IFS) advanced process technologies.

Improved CPU and GPU

MediaTek is pushing its Dimensity 9000 Plus launch earlier than expected.